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Tungsten-Titanium Targets

It is used as a diffusion barrier to prevent the diffusion of Al or Cu in Si, and has adhesion to the materials in contact with it.

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PRODUCT DETAILS


Application: 


It is used as a diffusion barrier to prevent the diffusion of Al or Cu in Si, and has adhesion to the materials in contact with it.

 

Product Property Parameters:

 

Chemical Compositions

 

Main Content, %

W

89.45~90.45

Ti

10±0.5

 

 

 

 

 

 

 

 

 

 

 

 

Impurity Content

(mass fraction), %, max

Fe

0.0030

Al

0.0020

Si

0.0010

Mg

0.0010

Ni

0.0010

Ca

0.0020

Cu

0.0010

Pb

0.0010

Bi

0.0010

Sn

0.0010

Sb

0.0010

As

0.0010

Mo

0.0060

P

0.0020

C

0.0020

N

0.0020

O

0.0020

 

Note: Molybdenum content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

 

Others:

 

Relative Density

Average Grain Size

(μm)

Roughness

(Ra, μm)

Flatness

(mm)

≥98%

≤100

≤0.8

≤1%

 

Size:

 

Shape

Thickness

(mm)

Width

(mm)

Length

(mm)

Diameter

(mm)

Round

3-25

-

-

≤450

 

Note: Special requirements will be agreed upon by the supplier and buyer.
 

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